The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Feb. 28, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Tsung-Fu Tsai, Changhua City, TW;
Kung-Chen Yeh, Taichung City, TW;
I-Ting Huang, Kaohsiung City, TW;
Shih-Ting Lin, Taipei City, TW;
Szu-Wei Lu, Hsinchu City, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10P 54/00 (2026.01); H10P 72/70 (2026.01); H10W 20/00 (2026.01); H10W 20/20 (2026.01); H10W 42/00 (2026.01); H10W 46/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10P 54/00 (2026.01); H10P 72/74 (2026.01); H10W 20/023 (2026.01); H10W 20/20 (2026.01); H10W 46/00 (2026.01); H10W 74/012 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10P 72/7436 (2026.01); H10W 46/503 (2026.01); H10W 90/20 (2026.01); H10W 90/291 (2026.01); H10W 90/297 (2026.01); H10W 90/722 (2026.01);
Abstract
A method for forming a package structure is provided, which includes recessing a substrate to form a trench, disposing a first stacked die package structure over the substrate, forming an underfill layer over the first stacked die package structure and in the trench, and forming a package layer over the underfill layer and in the trench.