Chih-Wei Wu

This inventor holds 104 USPTO granted patents and 24 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-50). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Epistar Corporation, Realtek Semiconductor Inc.. Active years: 2010-2026.

USPTO Granted Patents = 104 (Patent Applications = 24)

% Patents Active = 92.3

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 319(Granted Patents)

Forward Citations (Not Self Cited) = 250(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsinchu, TW (2010 - 2022)
Yilan, TW (2022)
Zhuangwei Township, TW (2013 - 2024)
Yilan County, TW (2018 - 2024)
Zhuangwei Township, Yilan County, TW (2021 - 2024)

Company Filing History:

92 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

patents

4. 2 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

5. 1 out of 4,577

Au Optronics Corporation

patents

6. 1 out of 207

Powertech Technology Inc.

patents

Years Active: 2010-2026

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Areas of Expertise:

Semiconductor Packaging

Joint Structures

Integrated Circuit Packages

3D Integration

Thermal Management

Signal Processing

Neural Networks

Chip Package Structures

Dummy Die Placement

Through-Silicon Vias

Electronic Devices

Manufacturing Methods

104 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740385 - Package and fabrication method thereof (2026-09-15),

2. 12721219 - Integrated circuit package and method (2026-08-25),

3. 12713992 - SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING (2026-08-18),

4. 12713949 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (2026-08-18),

5. 12702022 - Package structure and method of forming the same (2026-08-04),

6. 12660236 - Semiconductor structure and method for forming the same (2026-06-16),

7. 12648153 - Semiconductor device packages and methods of formation (2026-06-02),

8. 12635538 - Package structure with bridge die and method of forming the package structure (2026-05-19),

9. 12628697 - Package structure and manufacturing method thereof (2026-05-12),

10. 12564109 - Package component, electronic device and manufacturing method thereof (2026-02-24),

11. 12538559 - Semiconductor packages and methods of forming (2026-01-27),

12. 12506099 - Semiconductor package and manufacturing method thereof (2025-12-23),

13. 12462548 - Neural network system and signal processing method (2025-11-04),

14. 12437581 - Training system, training method and recognition system (2025-10-07),

15. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),

Title: The Innovative Journey of Chih-Wei Wu

Introduction: Chih-Wei Wu, a talented inventor hailing from Zhuangwei, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Chih-Wei Wu holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on a revolutionary method for enhancing data transmission speeds in wireless networks.

Career Highlights: Throughout his illustrious career, Chih-Wei Wu has been recognized for his innovative spirit and dedication to pushing the boundaries of technological advancement. His work has not only improved existing technologies but has also paved the way for future developments in the industry.

Collaborations: Chih-Wei Wu has collaborated with leading tech companies and research institutions to further his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Chih-Wei Wu stands as a shining example of a visionary inventor who continues to drive innovation in the field of technology. His passion for creating solutions to complex problems has earned him a well-deserved place among the top inventors of his generation.