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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ying-Ching Shih

USPTO Granted Patents = 131 

Average Co-Inventor Count = 4.4

ph-index = 12

Forward Citations = 757(Granted Patents)

Forward Citations (Not Self Cited) = 732(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Changhua County, TW (2009 - 2012)
  • Taipei, TW (2007 - 2019)
  • Hsinchu, TW (2010 - 2024)

Company Filing History:

goldMedal126 out of 40,848 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 9,157 
 
Industrial Technology Research Institute
 patents
bronzeMedal1 out of 1,721 
 
National Taiwan University
 patents

Years Active: 2007-2025

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Areas of Expertise:
Semiconductor Devices
Integrated Circuit Packages
Package Structures
Thermal Interface Materials
3D Semiconductor Packages
Underfill Structures
Chip-On-Wafer-On-Substrate
Joint Structures
Dummy Die Placement
Giga Interposer Integration
Stacked Pillar Portions
Manufacturing Methods
131 patents (USPTO):Explore Patents
1. 12500195 - Connecting structure, package structure and manufacturing method thereof (2025-12-16),
2. 12494401 - Semiconductor package and method (2025-12-09),
3. 12463108 - Semiconductor device and manufacturing method thereof (2025-11-04),
4. 12424587 - Semiconductor device having underfill surrounding bottom package and solder ball (2025-09-23),
5. 12381177 - Package structure and method of fabricating the same (2025-08-05),
6. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),
7. 12368123 - Package structure including stacked pillar portions and method for fabricating the same (2025-07-22),
8. 12362245 - Package assembly including a package lid having an inner foot and methods of making the same (2025-07-15),
9. 12347739 - Package structure (2025-07-01),
10. 12294002 - Integrated circuit package and method of forming same (2025-05-06),
11. 12272568 - Semiconductor package and manufacturing method thereof (2025-04-08),
12. 12230605 - Semiconductor package and manufacturing method thereof (2025-02-18),
13. 12183681 - Package structure having bridge structure for connection between semiconductor dies (2024-12-31),
14. 12148733 - Shift control method in manufacture of semiconductor device (2024-11-19),
15. 12148661 - Method of forming integrated fan-out packages with built-in heat sink (2024-11-19),

Title: The Innovative Journey of Inventor Ying-Ching Shih

Introduction: Ying-Ching Shih, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation.

Latest Patents: Shih's latest patents focus on advancements in semiconductor technology, particularly in the field of nanoelectronics and integrated circuits.

Career Highlights: With a career spanning over two decades, Shih has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Shih has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and knowledge sharing.

Conclusion: Ying-Ching Shih's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.

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