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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ying-Ching Shih

This inventor holds 151 USPTO granted patents and 63 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute, National Taiwan University. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ying-Ching Shih. Retrieved from https://idiyas.com/inventor/ying-ching-shih

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 151 

% Patents Active = 96.0

Average Co-Inventor Count = 4.3

ph-index = 12

Forward Citations = 858(Granted Patents)

Forward Citations (Not Self Cited) = 732(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Changhua County, TW (2009 - 2012)
  • Taipei, TW (2007 - 2019)
  • Hsinchu, TW (2010 - 2024)

Company Filing History:

goldMedal146 out of 43,653 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 9,323 
 
Industrial Technology Research Institute
 patents
bronzeMedal1 out of 1,402 
 
National Taiwan University
 patents

Years Active: 2007-2026

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Areas of Expertise:
Semiconductor Package
Integrated Circuit Package
Thermal Interface Materials
Manufacturing Methods
Package Structure
Underfill Structure
3D Semiconductor Packages
Chip Package Structure
Giga Interposer Integration
Joint Structure
Electronic Device
Stacked Pillar Portions
151 patents (USPTO):Explore Patents
1. 12787832 - Package structure and method of fabricating the same (2026-11-03),
2. 12777951 - Package structure with connecting structure and manufacturing method thereof (2026-10-27),
3. 12740411 - Package structure including a package lid having a plurality of fins and methods of forming the same (2026-09-15),
4. 12740385 - Package and fabrication method thereof (2026-09-15),
5. 12721219 - Integrated circuit package and method (2026-08-25),
6. 12713992 - SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING (2026-08-18),
7. 12713949 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (2026-08-18),
8. 12708011 - Semiconductor device, package structure and method of fabricating the same (2026-08-11),
9. 12707966 - Semiconductor device (2026-08-11),
10. 12702022 - Package structure and method of forming the same (2026-08-04),
11. 12660616 - Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly (2026-06-16),
12. 12648153 - Semiconductor device packages and methods of formation (2026-06-02),
13. 12635538 - Package structure with bridge die and method of forming the package structure (2026-05-19),
14. 12628713 - Giga interposer integration through chip-on-wafer-on-substrate (2026-05-12),
15. 12628697 - Package structure and manufacturing method thereof (2026-05-12),

Title: The Innovative Journey of Inventor Ying-Ching Shih

Introduction: Ying-Ching Shih, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation.

Latest Patents: Shih's latest patents focus on advancements in semiconductor technology, particularly in the field of nanoelectronics and integrated circuits.

Career Highlights: With a career spanning over two decades, Shih has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Shih has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and knowledge sharing.

Conclusion: Ying-Ching Shih's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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