Ying-Ching Shih

USPTO Granted Patents = 130 (Patent Applications = 63)

Average Co-Inventor Count = 4.4

ph-index = 12

Forward Citations = 755(Granted Patents)

Forward Citations (Not Self Cited) = 732(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Changhua County, TW (2009 - 2012)
Taipei, TW (2007 - 2019)
Hsinchu, TW (2010 - 2024)

Company Filing History:

125 out of 40,674

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

4 out of 9,144

Industrial Technology Research Institute

patents

1 out of 1,713

National Taiwan University

patents

Years Active: 2007-2025

Loading Chart...

Areas of Expertise:

Semiconductor Devices

Integrated Circuit Packages

Package Structures

Thermal Interface Materials

3D Semiconductor Packages

Underfill Structures

Chip-On-Wafer-On-Substrate

Joint Structures

Dummy Die Placement

Giga Interposer Integration

Stacked Pillar Portions

Manufacturing Methods

130 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12494401 - Semiconductor package and method (2025-12-09),

2. 12463108 - Semiconductor device and manufacturing method thereof (2025-11-04),

3. 12424587 - Semiconductor device having underfill surrounding bottom package and solder ball (2025-09-23),

4. 12381177 - Package structure and method of fabricating the same (2025-08-05),

5. 12368132 - Joint structure in semiconductor package and manufacturing method thereof (2025-07-22),

6. 12368123 - Package structure including stacked pillar portions and method for fabricating the same (2025-07-22),

7. 12362245 - Package assembly including a package lid having an inner foot and methods of making the same (2025-07-15),

8. 12347739 - Package structure (2025-07-01),

9. 12294002 - Integrated circuit package and method of forming same (2025-05-06),

10. 12272568 - Semiconductor package and manufacturing method thereof (2025-04-08),

11. 12230605 - Semiconductor package and manufacturing method thereof (2025-02-18),

12. 12183681 - Package structure having bridge structure for connection between semiconductor dies (2024-12-31),

13. 12148733 - Shift control method in manufacture of semiconductor device (2024-11-19),

14. 12148661 - Method of forming integrated fan-out packages with built-in heat sink (2024-11-19),

15. 12119324 - Package structure (2024-10-15),

Title: The Innovative Journey of Inventor Ying-Ching Shih

Introduction: Ying-Ching Shih, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation.

Latest Patents: Shih's latest patents focus on advancements in semiconductor technology, particularly in the field of nanoelectronics and integrated circuits.

Career Highlights: With a career spanning over two decades, Shih has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Shih has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and knowledge sharing.

Conclusion: Ying-Ching Shih's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

63 patents pending:

Please report any incorrect information to support@idiyas.com

1 patent pending (EPO):

Please report any incorrect information to support@idiyas.com

Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.