Ying-Ching Shih

This inventor holds 149 USPTO granted patents and 55 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2007-2026.

USPTO Granted Patents = 149 (Patent Applications = 55)

% Patents Active = 96.0

Average Co-Inventor Count = 4.3

ph-index = 12

Forward Citations = 843(Granted Patents)

Forward Citations (Not Self Cited) = 732(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Changhua County, TW (2009 - 2012)
Taipei, TW (2007 - 2019)
Hsinchu, TW (2010 - 2024)

Company Filing History:

140 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

4 out of 9,299

Industrial Technology Research Institute

patents

4 out of 450

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

4. 1 out of 1,390

National Taiwan University

patents

Years Active: 2007-2026

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Areas of Expertise:

Semiconductor Package

Integrated Circuit Package

Thermal Interface Materials

Manufacturing Methods

Package Structure

Underfill Structure

3D Semiconductor Packages

Chip Package Structure

Giga Interposer Integration

Joint Structure

Electronic Device

Stacked Pillar Portions

149 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740411 - Package structure including a package lid having a plurality of fins and methods of forming the same (2026-09-15),

2. 12740385 - Package and fabrication method thereof (2026-09-15),

3. 12721219 - Integrated circuit package and method (2026-08-25),

4. 12713992 - SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING (2026-08-18),

5. 12713949 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (2026-08-18),

6. 12708011 - Semiconductor device, package structure and method of fabricating the same (2026-08-11),

7. 12707966 - Semiconductor device (2026-08-11),

8. 12702022 - Package structure and method of forming the same (2026-08-04),

9. 12660616 - Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly (2026-06-16),

10. 12648153 - Semiconductor device packages and methods of formation (2026-06-02),

11. 12635538 - Package structure with bridge die and method of forming the package structure (2026-05-19),

12. 12628713 - Giga interposer integration through chip-on-wafer-on-substrate (2026-05-12),

13. 12628697 - Package structure and manufacturing method thereof (2026-05-12),

14. 12616025 - Semiconductor package fixture and methods of manufacturing (2026-04-28),

15. 12604781 - Package structure including guiding patterns (2026-04-14),

Title: The Innovative Journey of Inventor Ying-Ching Shih

Introduction: Ying-Ching Shih, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation.

Latest Patents: Shih's latest patents focus on advancements in semiconductor technology, particularly in the field of nanoelectronics and integrated circuits.

Career Highlights: With a career spanning over two decades, Shih has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Shih has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and knowledge sharing.

Conclusion: Ying-Ching Shih's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.