Package structure with connecting structure and manufacturing method thereof

Abstract

A package structure includes a first redistribution circuit structure, a first semiconductor die, and a second semiconductor die. The first redistribution circuit structure has a first side and a second side opposite to the first side. The first semiconductor die is disposed over the firs side of the first redistribution circuit structure. The second semiconductor die is disposed over the second side of the first redistribution circuit structure and is electrically connected thereto, where the second semiconductor die includes a substrate, an interconnect structure disposed on the substrate, a plurality of conductive terminals disposed on and electrically connected to the interconnect structure, and a dielectric layer disposed on the interconnect structure and laterally covering the plurality of conductive terminals. A material of the dielectric layer included in the second semiconductor die is different from a material of a dielectric layer included in the first redistribution circuit structure.