Chin-Chuan Chang

This inventor holds 46 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Chuan Chang. Retrieved from https://idiyas.com/inventor/chin-chuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 46 (Patent Applications = 18)

% Patents Active = 95.7

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 1,491(Granted Patents)

Location History:

Zhudong Township, Hsinchu County, TW (2021 - 2023)
Zhudong Township, TW (2014 - 2024)
Hsinchu County, TW (2019 - 2024)

Company Filing History:

46 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Package Structure

Semiconductor Package

Integrated Circuit

Thermal Layers

Mechanical Layers

Substrate Thinning

Stacked Dies

Fan-Out Interconnects

3-D Package

Molding Wafer Chamber

Endpoint Detection

Manufacturing Method

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12604781 - Package structure including guiding patterns (2026-04-14),

2. 12482773 - Integrated circuit structure, and method for forming thereof (2025-11-25),

3. 12412841 - Semiconductor package and manufacturing method thereof (2025-09-09),

4. 12327819 - Devices employing thermal and mechanical enhanced layers and methods of forming same (2025-06-10),

5. 12255155 - Package structure with stacked semiconductor dies (2025-03-18),

6. 12255079 - Semiconductor package and method of manufacturing the same (2025-03-18),

7. 12131965 - Apparatus for detecting end point (2024-10-29),

8. 12074112 - Package structure (2024-08-27),

9. 11996375 - Integrated circuit structure, and method for forming thereof (2024-05-28),

10. 11948930 - Semiconductor package and method of manufacturing the same (2024-04-02),

11. 11929261 - Semiconductor package and method of manufacturing the same (2024-03-12),

12. 11862523 - Apparatus for detecting end point (2024-01-02),

13. 11854984 - Semiconductor package and manufacturing method thereof (2023-12-26),

14. 11728190 - System for thinning substrate (2023-08-15),

15. 11670597 - Method for forming package structure (2023-06-06),

Title: The Innovative Journey of Chin-Chuan Chang

Introduction: Chin-Chuan Chang, a pioneering inventor hailing from Zhudong, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Chin-Chuan Chang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Chin-Chuan Chang has established himself as a leading figure in the tech industry. His innovative solutions have revolutionized the way we harness and utilize clean energy sources.

Collaborations: Throughout his career, Chin-Chuan Chang has collaborated with top research institutions and universities to further his research and bring his inventions to life. His partnerships have led to the successful implementation of cutting-edge technologies in various sectors.

Conclusion: Chin-Chuan Chang's relentless pursuit of innovation and his passion for creating a sustainable future have solidified his position as a visionary inventor. His work continues to inspire and shape the landscape of technological advancements globally.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

18 patents pending: