The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
May. 22, 2023
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Ching-Chen Li, Hsinchu City, TW;
Chin-Chuan Chang, Zhudong Township, TW;
Chen-Hsuan Tsai, Taitung City, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A package includes a first die and a second die in an encapsulant layer, and a dummy bar in the encapsulant layer and adjacent a gap between the first die and the second die. A method of forming a package includes attaching a first die and a second die to a surface, attaching a dummy bar to the surface adjacent a gap between the first die and the second die, and forming an encapsulant layer on the first die, the second die and the dummy bar.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile