Ching-Chen Li

Title: Ching-Chen Li: Innovator in Semiconductor Packaging

Introduction

Ching-Chen Li is a talented inventor based in Hsinchu City, Taiwan. She has made significant contributions to the field of semiconductor packaging, focusing on innovative methods and structures that enhance the functionality and efficiency of electronic devices.

Latest Patent Applications

Ching-Chen Li has filed several notable patent applications, including:

1. **PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME** - This application describes a package structure that includes a first semiconductor die, a second semiconductor die, an insulating encapsulant, and a redistribution layer. The insulating encapsulant surrounds both semiconductor dies, with specific recessed parts designed to optimize the packaging process.

2. **PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE** - This application outlines a package that incorporates a dummy bar adjacent to a gap between the first and second dies. The method of forming this package involves attaching the dies and dummy bar to a surface, followed by the formation of an encapsulant layer.

Conclusion

Ching-Chen Li is an innovative inventor whose work in semiconductor packaging is paving the way for advancements in electronic device technology. Her latest patent applications reflect her commitment to improving packaging methods and structures.