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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12074112 B1

PDFFull Text
Date of Patent:
Aug. 27, 2024

Filed:

Apr. 26, 2023

Package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chin-Chuan Chang, Zhudong Township, TW;

Szu-Wei Lu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A package structure is provided. The package structure includes a first redistribution structure and an interposer over the first redistribution structure. The interposer includes a through via electrically connected to the first redistribution structure and a conductive pillar over the through via. The package structure also includes a first molding compound layer surrounding the interposer. The package structure further includes a second redistribution structure over the first molding compound layer and electrically connected to the conductive pillar. The package structure also includes a semiconductor die over and electrically connected to the second redistribution structure.

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