The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 20, 2023
Package structure including a package lid having a plurality of fins and methods of forming the same
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Ping-Yin Hsieh, Hsinchu City, TW;
Chih-Hao Chen, Taipei City, TW;
Li-Hui Cheng, New Taipei City, TW;
Ying-Ching Shih, Hsinchu City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 40/70 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 76/01 (2026.01); H10W 76/12 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/226 (2026.01); H10W 40/70 (2026.01); H10W 72/071 (2026.01); H10W 76/01 (2026.01); H10W 76/161 (2026.01); H10W 72/352 (2026.01); H10W 90/736 (2026.01);
Abstract
A package structure includes a package substrate, an interposer module on the package substrate, a thermal interface material (TIM) layer on the interposer module, and a package lid on the TIM layer, including a package lid foot portion attached to the package substrate, a package lid plate portion connected to the package lid foot portion, and a plurality of fins extending from the package lid plate portion into the TIM layer over the interposer module.