Hsinchu, Taiwan

Ping-Yin Hsieh

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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9 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Ping-Yin Hsieh

Introduction

Ping-Yin Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor device and manufacturing method that includes a substrate, a package structure, a thermal interface material (TIM) structure, and a lid structure. This innovative design aims to improve the thermal management of semiconductor devices. Another notable patent is for coplanar control for film-type thermal interface, which outlines a method for bonding packages and applying thermal interface materials effectively.

Career Highlights

Ping-Yin Hsieh has built a successful career at Taiwan Semiconductor Manufacturing Company Limited, where he has been instrumental in advancing semiconductor technologies. His expertise in thermal interface materials and device packaging has positioned him as a key player in the industry.

Collaborations

Throughout his career, Hsieh has collaborated with talented individuals such as Li-Hui Cheng and Szu-Wei Lu. These partnerships have fostered innovation and contributed to the development of cutting-edge semiconductor solutions.

Conclusion

Ping-Yin Hsieh's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the industry and drive advancements in semiconductor manufacturing.

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