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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ping-Yin Hsieh

This inventor holds 17 USPTO granted patents and 21 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ping-Yin Hsieh. Retrieved from https://idiyas.com/inventor/ping-yin-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal14 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2020-2026

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17 patents (USPTO):Explore Patents
1. 12740411 - Package structure including a package lid having a plurality of fins and methods of forming the same (2026-09-15),
2. 12713909 - Multi-TIM Packages and Method Forming Same (2026-08-18),
3. 12672543 - Integrated circuit packages and methods of forming the same (2026-06-30),
4. 12666964 - Package structure and manufacturing method thereof (2026-06-23),
5. 12660616 - Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly (2026-06-16),
6. 12642086 - Multi-TIM packages and method forming same (2026-05-26),
7. 12635590 - Semiconductor device and manufacturing method thereof (2026-05-19),
8. 12500134 - Package assembly including a package lid having a step region and method of making the same (2025-12-16),
9. 12494401 - Semiconductor package and method (2025-12-09),
10. 12463108 - Semiconductor device and manufacturing method thereof (2025-11-04),
11. 12278162 - Coplanar control for film-type thermal interface (2025-04-14),
12. 12068173 - Package structure and manufacturing method thereof (2024-08-20),
13. 12033912 - Package structure and manufacturing method thereof (2024-07-09),
14. 11973005 - Coplanar control for film-type thermal interface (2024-04-30),
15. 11699597 - Package structure and manufacturing method thereof (2023-07-11),

Title: The Innovative Contributions of Ping-Yin Hsieh

Introduction

Ping-Yin Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor device and manufacturing method that includes a substrate, a package structure, a thermal interface material (TIM) structure, and a lid structure. This innovative design aims to improve the thermal management of semiconductor devices. Another notable patent is for coplanar control for film-type thermal interface, which outlines a method for bonding packages and applying thermal interface materials effectively.

Career Highlights

Ping-Yin Hsieh has built a successful career at Taiwan Semiconductor Manufacturing Company Limited, where he has been instrumental in advancing semiconductor technologies. His expertise in thermal interface materials and device packaging has positioned him as a key player in the industry.

Collaborations

Throughout his career, Hsieh has collaborated with talented individuals such as Li-Hui Cheng and Szu-Wei Lu. These partnerships have fostered innovation and contributed to the development of cutting-edge semiconductor solutions.

Conclusion

Ping-Yin Hsieh's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the industry and drive advancements in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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