The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Aug. 06, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yu-Hsun Wang, Zhubei, TW;
Ping-Yin Hsieh, Hsinchu, TW;
Pu Wang, Hsinchu, TW;
Li-Hui Cheng, New Taipei, TW;
Szu-Wei Lu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2005.12); H01L 23/367 (2005.12); H01L 25/00 (2005.12); H01L 25/065 (2022.12); H01L 23/498 (2005.12); H01L 25/18 (2022.12);
U.S. Cl.
CPC ...
H01L 23/433 (2012.12); H01L 23/3675 (2012.12); H01L 25/0652 (2012.12); H01L 25/0655 (2012.12); H01L 25/50 (2012.12); H01L 23/49833 (2012.12); H01L 25/18 (2012.12);
Abstract
A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.