This inventor holds 53 USPTO granted patents and 37 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.
Company Filing History:
50 out of 42,679 
3 out of 437 Years Active: 2015-2026
Areas of Expertise:
Title: Innovations of Pu Wang in Semiconductor Packaging
Introduction
Pu Wang, an accomplished inventor based in Hsinchu, Taiwan, holds an impressive portfolio of 38 patents in the semiconductor industry. His innovative solutions focus primarily on advancements in semiconductor packaging, reflecting his expertise and contributions to the field.
Latest Patents
Among his latest patents are two significant inventions that showcase his technical ingenuity. The first, titled "Package structure with metallic layer over the surfaces of a plurality of semiconductor dies," outlines a novel package structure that includes first and second components, an underfill layer, and a metallic layer. This invention enhances the connectivity of semiconductor dies through a redistribution structure, providing improved reliability and performance.
The second patent involves a "Manufacturing method of a semiconductor package using jig." This innovation introduces a jig comprising a bottom piece and an upper piece, designed to streamline the manufacturing process of semiconductor packages. With its unique structure, this jig optimizes the alignment and support during production, aiding in the precision of semiconductor packaging.
Career Highlights
Pu Wang is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, where he utilizes his extensive knowledge to push the boundaries of semiconductor technology. His numerous patents reflect his dedication to enhancing the efficiency and effectiveness of manufacturing processes in the semiconductor realm.
Collaborations
In his innovative journey, Pu Wang collaborates with talented coworkers, including Szu-Wei Lu and Ying-Ching Shih. Together, they contribute to the development of groundbreaking technologies and solutions that further solidify their company’s standing in the semiconductor industry.
Conclusion
Pu Wang's commitment to innovation in semiconductor packaging is evident through his significant contributions and patents. His work not only advances the technology but also sets a foundation for future developments in the industry, showcasing the vital role inventors play in shaping technological advancements.