The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Aug. 31, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chih-Chien Pan, Taipei City, TW;
Pu Wang, Hsinchu City, TW;
Li-Hui Cheng, New Taipei City, TW;
Ying-Ching Shih, Hsinchu City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 70/69 (2026.01); H10W 74/15 (2026.01); H10W 76/10 (2026.01); H10W 76/60 (2026.01); H10W 76/63 (2026.01); H10W 76/67 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 70/685 (2026.01); H10W 74/15 (2026.01); H10W 76/10 (2026.01); H10W 76/60 (2026.01); H10W 76/63 (2026.01); H10W 76/67 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.