Average Co-Inventor Count = 4.36
ph-index = 12
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (123 from 40,053 patents)
2. Industrial Technology Research Institute (4 from 9,108 patents)
3. National Taiwan University (1 from 1,697 patents)
128 patents:
1. 12424587 - Semiconductor device having underfill surrounding bottom package and solder ball
2. 12381177 - Package structure and method of fabricating the same
3. 12368132 - Joint structure in semiconductor package and manufacturing method thereof
4. 12368123 - Package structure including stacked pillar portions and method for fabricating the same
5. 12362245 - Package assembly including a package lid having an inner foot and methods of making the same
6. 12347739 - Package structure
7. 12294002 - Integrated circuit package and method of forming same
8. 12272568 - Semiconductor package and manufacturing method thereof
9. 12230605 - Semiconductor package and manufacturing method thereof
10. 12183681 - Package structure having bridge structure for connection between semiconductor dies
11. 12148661 - Method of forming integrated fan-out packages with built-in heat sink
12. 12148733 - Shift control method in manufacture of semiconductor device
13. 12119324 - Package structure
14. 12087727 - Joint structure in semiconductor package and manufacturing method thereof
15. 12080617 - Underfill structure for semiconductor packages and methods of forming the same