The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Feb. 02, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shin-Wei Shen, Tainan City, TW;
Chi-Hsiang Chen, Taipei City, TW;
Yi-Chao Mao, Taoyuan City, TW;
Tsung-Fu Tsai, Changhua County, TW;
Szu-Wei Lu, Hsinchu City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A die-transfer tool includes a source frame stage, a target frame stage, a roller, and a driving mechanism. The source frame stage is configured to secure a first tape. The target frame stage is configured to secure a second tape, wherein the second tape has an adhesive surface facing the source frame stage when the second tape is mounted on the target frame stage. The roller is configured to move laterally over the non-adhesive surface of the second tape opposite the adhesive surface when a plurality of dies is between the first tape and the adhesive surface of the second tape. The driving mechanism is configured to vertically drive the target frame stage to adjust the relative position of the target frame stage above the source frame stage.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile