The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
May. 04, 2007
Applicants:
Chien-hsiun Lee, Hsin-Chu, TW;
Ming-chung Sung, Taichung, TW;
Clinton Chao, Hsin-Chu, TW;
Tjandra Winata Karta, Hsin-Chu, TW;
Inventors:
Chien-Hsiun Lee, Hsin-Chu, TW;
Ming-Chung Sung, Taichung, TW;
Clinton Chao, Hsin-Chu, TW;
Tjandra Winata Karta, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming an integrated circuit structure is provided. The method includes providing an interposer wafer; mounting the interposer wafer onto a handling wafer; thinning a backside of the interposer wafer; removing the handling wafer from the interposer wafer after the step of thinning; securing the interposer wafer on a fixture; and bonding a die on the interposer wafer.