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For the Inventor, By the Inventor

Taichung, Taiwan

Ming-Chung Sung

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.6

ph-index = 4

Forward Citations = 57(Granted Patents)


Company Filing History:

goldMedal13 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2007-2018

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13 patents (USPTO):Explore Patents
1. 9985013 - Package-on-package structure and methods for forming the same (2018-05-29),
2. 9165876 - Package-on-package structure and methods for forming the same (2015-10-20),
3. 9147584 - Rotating curing (2015-09-29),
4. 8927877 - Looped interconnect structure (2015-01-06),
5. 8823180 - Package on package devices and methods of packaging semiconductor dies (2014-09-02),
6. 8796132 - System and method for forming uniform rigid interconnect structures (2014-08-05),
7. 8664039 - Methods and apparatus for alignment in flip chip bonding (2014-03-04),
8. 8652939 - Method and apparatus for die assembly (2014-02-18),
9. 8232183 - Process and apparatus for wafer-level flip-chip assembly (2012-07-31),
10. 7977155 - Wafer-level flip-chip assembly methods (2011-07-12),
11. 7951647 - Performing die-to-wafer stacking by filling gaps between dies (2011-05-31),
12. 7642631 - Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer (2010-01-05),
13. 7265034 - Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade (2007-09-04),

Title: Innovator of Advanced Packaging Technologies - Ming-Chung Sung

Introduction

Ming-Chung Sung, a prominent inventor based in Taichung, Taiwan, has made significant contributions in the field of semiconductor packaging. With a remarkable portfolio of 13 patents, he has developed innovative solutions that bolster the efficiency and performance of electronic devices.

Latest Patents

Among his latest groundbreaking patents is a method for creating a package-on-package structure. This method involves coining solder balls of a bottom package, ensuring that the top surfaces of the solder balls are flattened through a precise coining process. The solder balls are then molded within a protective material, allowing their top surfaces to be accessed through trenches in the molding material. This innovation enhances the reliability and functionality of semiconductor devices, reflecting Ming-Chung's expertise and dedication to advancing technology.

Career Highlights

Ming-Chung is currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in the semiconductor industry. His role involves the exploration and development of advanced packaging technologies that are vital for modern electronic applications. His contributions have not only propelled his career but have also positioned TSMC at the forefront of technological innovation in the semiconductor sector.

Collaborations

Throughout his career, Ming-Chung has collaborated with notable colleagues, including Chien-Hsiun Lee and Mirng-Ji Lii. These collaborations have furthered the development of cutting-edge semiconductor solutions, demonstrating the power of teamwork in achieving groundbreaking strides in the industry.

Conclusion

Ming-Chung Sung exemplifies the spirit of innovation within the semiconductor field. His insights and inventions continue to pave the way for enhancements in packaging technologies, thereby contributing to the evolution of electronics. With each patent, he not only advances his career but also significantly impacts the industry as a whole.

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