The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Jun. 17, 2008
Applicants:
Ku-feng Yang, Dali, TW;
Wen-chih Chiou, Miaoli, TW;
Weng-jin Wu, Hsin-Chu, TW;
Ming-chung Sung, Taichung, TW;
Inventors:
Ku-Feng Yang, Dali, TW;
Wen-Chih Chiou, Miaoli, TW;
Weng-Jin Wu, Hsin-Chu, TW;
Ming-Chung Sung, Taichung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit structure includes a bottom semiconductor chip; a top die bonded onto the bottom semiconductor chip; a protecting material encircling the bottom die and on the bottom semiconductor chip; and a planar dielectric layer over the top die and the protecting material. The protecting material has a top surface leveled with a top surface of the top die.