This inventor holds 84 USPTO granted patents and 1 EPO patent, primarily in Image Sensor Packaging (CPC class H01L27-14618). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Semiconductor Components Industries, LLC. Active years: 2008-2024.
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Company Filing History:
68 out of 42,711 
16 out of 3,714 
Years Active: 2008-2024
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As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with the requested article about inventor Weng-Jin Wu.
Title: Innovator Spotlight: Weng-Jin Wu
Introduction: Weng-Jin Wu, a prolific inventor based in Hsinchu, Taiwan, has made significant contributions to the field of sensor technology with a remarkable portfolio of 84 patents to his name.
Latest Patents:
1. *Controllable gap height for an image sensor package*: Weng-Jin Wu's innovation involves an image sensor package with a unique design that optimizes light reception for enhanced imaging capabilities.
2. *Packaging structure for a sensor having a sealing layer*: This patent showcases Wu's expertise in sensor packaging, focusing on efficient bonding and sealing techniques to ensure sensor integrity.
Career Highlights: Wu has demonstrated his technical prowess in leading companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Semiconductor Components Industries, LLC, where he played a vital role in driving innovation and technology advancements.
Collaborations: Throughout his career, Weng-Jin Wu has collaborated with esteemed professionals in the industry, including Wen-Chih Chiou and Chen-Hua Douglas Yu, to develop cutting-edge solutions in sensor technology and packaging.
Conclusion: Weng-Jin Wu's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the field of sensor technology. His patents and contributions continue to shape the future of imaging and sensor applications, inspiring fellow inventors and industry professionals worldwide.
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