Hsinchu, Taiwan

Weng-Jin Wu



Average Co-Inventor Count = 2.6

ph-index = 11

Forward Citations = 786(Granted Patents)


Inventors with similar research interests:


Company Filing History:


Years Active: 2008-2024

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Areas of Expertise:
Image Sensor Packaging
Semiconductor Substrate Stack
Thin Wafer Handling
Three Dimensional Integrated Circuits
Through-Silicon Via
Molded Chip Scale Packages
Contamination Barrier Structures
Substrate Bonding Techniques
Multi-Die Stacking
Wafer Thinning Process
Alignment Marks
Bonding Methods
84 patents (USPTO):Explore Patents

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with the requested article about inventor Weng-Jin Wu.

Title: Innovator Spotlight: Weng-Jin Wu

Introduction: Weng-Jin Wu, a prolific inventor based in Hsinchu, Taiwan, has made significant contributions to the field of sensor technology with a remarkable portfolio of 84 patents to his name.

Latest Patents:

1. *Controllable gap height for an image sensor package*: Weng-Jin Wu's innovation involves an image sensor package with a unique design that optimizes light reception for enhanced imaging capabilities.

2. *Packaging structure for a sensor having a sealing layer*: This patent showcases Wu's expertise in sensor packaging, focusing on efficient bonding and sealing techniques to ensure sensor integrity.

Career Highlights: Wu has demonstrated his technical prowess in leading companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Semiconductor Components Industries, LLC, where he played a vital role in driving innovation and technology advancements.

Collaborations: Throughout his career, Weng-Jin Wu has collaborated with esteemed professionals in the industry, including Wen-Chih Chiou and Chen-Hua Douglas Yu, to develop cutting-edge solutions in sensor technology and packaging.

Conclusion: Weng-Jin Wu's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the field of sensor technology. His patents and contributions continue to shape the future of imaging and sensor applications, inspiring fellow inventors and industry professionals worldwide.

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