Jen-Cheng Liu

Title: Jen-Cheng Liu: Innovator Extraordinaire in the Field of Integrated Chip Structures

Introduction:

In the rapidly evolving world of semiconductor technology, inventors like Jen-Cheng Liu continue to push the boundaries of what is possible. With a remarkable portfolio of 319 patents and a distinguished career at Taiwan Semiconductor Manufacturing Co. Ltd., Liu is a true trailblazer in the field of integrated chip structures. This article delves into some of his latest patents, career highlights, and collaborations with fellow innovators.

Latest Patents:

One of Jen-Cheng Liu's recent inventions is the "Stacked Substrate Structure with Inter-Tier Interconnection." This integrated chip structure involves a bonding structure, inter-tier interconnect structure, and dielectric structures on separate substrates. By enabling the integration of multiple interconnects, this technology enhances the efficiency and performance of integrated circuits.

Another notable patent from Liu is the "3DIC Interconnect Apparatus and Method." This invention focuses on bonding two integrated circuits and forming interconnects between them. By utilizing multi-layer dielectric films, conductive plugs, and precise etching techniques, Liu's innovation helps achieve higher density and improved functionality in 3D integrated circuits.

Career Highlights:

Jen-Cheng Liu's illustrious career has been closely intertwined with Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), a global leader in semiconductor foundries. With his exceptional expertise in integrated chip structures, Liu has made significant contributions to TSMC's advancements in semiconductor technology. His 319 patents are a testament to his dedication and innovative spirit.

Collaborations:

Innovation often thrives through collaborations, and Jen-Cheng Liu has had the privilege of working with remarkable individuals within TSMC. Notably, he has collaborated with inventors Dun-Nian Yaung and Min-Feng Kao. Their collective efforts have led to groundbreaking advancements in integrated chip structures. Working as a cohesive unit, they have propelled TSMC's position as a frontrunner in semiconductor manufacturing.

Conclusion:

Jen-Cheng Liu's relentless pursuit of innovation in integrated chip structures has made him a key figure in the field. Through his numerous patents and his significant contributions to TSMC, Liu has cemented his position as an industry-leading inventor. With each invention, he continues to reshape the semiconductor landscape and drive technological progress. We eagerly await the future breakthroughs that this brilliant mind will bring to the world of integrated chip structures.