The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jun. 11, 2012
Tsung-ding Wang, Tainan, TW;
Ming-chung Sung, Taichung, TW;
Jiun Yi Wu, Zhongli, TW;
Chien-hsiun Lee, Chu-tung Town, TW;
Mirng-ji Lii, Sinpu Township, TW;
Tsung-Ding Wang, Tainan, TW;
Ming-Chung Sung, Taichung, TW;
Jiun Yi Wu, Zhongli, TW;
Chien-Hsiun Lee, Chu-tung Town, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a bottom packaged die having solder balls disposed on the top surface thereof and a top packaged die having metal stud bumps disposed on a bottom surface thereof. The metal stud bumps include a bump region and a tail region coupled to the bump region. Each metal stud bump on the top packaged die is coupled to one of the solder balls on the bottom packaged die.