The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
May. 04, 2007
Chien-hsiun Lee, Hsin-Chu, TW;
Clinton Chao, Hsin-Chu, TW;
Ming-chung Sung, Taichung, TW;
Tjandra Winata Karta, Hsin-Chu, TW;
Chien-Hsiun Lee, Hsin-Chu, TW;
Clinton Chao, Hsin-Chu, TW;
Ming-Chung Sung, Taichung, TW;
Tjandra Winata Karta, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of packaging integrated circuit structures is provided. The method includes providing a wafer having bonding conductors on a surface of the wafer, and applying a compound underfill onto the surface of the wafer. The compound underfill includes an underfill material and a flux material. A die is then bonded on the wafer after the step of applying the compound underfill, wherein solder bumps on the die are joined with the bonding conductors.