The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Mar. 26, 2004
Yen-ming Chen, Hsin-Chu, TW;
Chia-fu Lin, Hsin-Chu, TW;
Shun-liang Hsu, Hsin-Chu, TW;
Kai-ming Ching, Taiping, TW;
Hsin-hui Lee, Kaohsiung, TW;
Chao-yuan Su, Kaohsiung, TW;
Li-chih Chen, Taipei, TW;
Yen-Ming Chen, Hsin-Chu, TW;
Chia-Fu Lin, Hsin-Chu, TW;
Shun-Liang Hsu, Hsin-Chu, TW;
Kai-Ming Ching, Taiping, TW;
Hsin-Hui Lee, Kaohsiung, TW;
Chao-Yuan Su, Kaohsiung, TW;
Li-Chih Chen, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Abstract
A new method is provided for the creation of a solder bump. Conventional methods are initially followed, creating a patterned layer of Under Bump Metal over the surface of a contact pad. A layer of photoresist is next deposited, this layer of photoresist is patterned and developed creating a resist mask having a T-shape opening aligned with the contact pad. This T-shaped opening is filled with a solder compound, creating a T-shaped layer of solder compound on the surface of the layer of UBM. The layer of photoresist is removed, exposing the created T-shaped layer of solder compound, further exposing the layer of UBM. The layer of UBM is etched using the T-shaped layer of solder compound as a mask. Reflow of the solder compound results in creating a solder ball.