Introduction: Li-Chih Chen, a distinguished inventor based in Taipei, Taiwan, has made significant strides in the field of semiconductor technology. With a remarkable portfolio comprising nine patents, Chen's inventions are pivotal in enhancing the reliability and efficiency of electronic devices. His innovative methods are shaping the future of semiconductor manufacturing.

Latest Patents: Among his latest patents, Chen developed a groundbreaking method to improve bump reliability for flip chip devices. This method involves creating a solder bump through a sequence of steps, starting with the formation of a patterned Under Bump Metal (UBM) layer. Following that, a photoresist layer is applied and developed to create a T-shaped opening. This opening is filled with a solder compound, leading to the creation of a T-shaped layer of solder. The process culminates in the etching of the UBM and the reflow of the solder to produce a reliable solder ball. Another notable patent from Chen is the fluxless bumping process, which incorporates a semiconductor device with a bond pad and an under bump metallurgy. This innovative process includes forming a solder structure with an outer layer of tin oxide and utilizing plasma exposure for heating and cooling to achieve a reliable solder bump.

Career Highlights: Li-Chih Chen is an employee of Taiwan Semiconductor Manufacturing Company (TSMC), a global leader in semiconductor production. During his tenure, he has contributed significantly to developing advanced techniques that enhance device performance and reliability. His impressive track record of patents reflects his deep expertise and commitment to innovation in the semiconductor industry.

Collaborations: Chen's work has often been in collaboration with esteemed colleagues such as Hsin-Hui Lee and Chao-Yuan Su. Their collective efforts have resulted in noteworthy advancements in semiconductor technology, underscoring the importance of teamwork in driving scientific progress.

Conclusion: Li-Chih Chen's innovative contributions to semiconductor technologies mark him as a significant figure in the field. With his nine patents, including methods for improving bump reliability and introducing fluxless bumping processes, Chen continues to push the boundaries of what is possible in electronics. His collaboration with talented colleagues and his influential role at Taiwan Semiconductor Manufacturing Company solidify his status as a leader in innovation.

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