Kaohsiung, Taiwan

Hsin-Hui Lee

USPTO Granted Patents = 56 

Average Co-Inventor Count = 3.9

ph-index = 12

Forward Citations = 544(Granted Patents)

Forward Citations (Not Self Cited) = 537(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Koashiung, TW (2003)
  • Kaoshingh, TW (2004)
  • Kuohsiung, TW (2005)
  • Hsin-Chu, TW (2003 - 2006)
  • Koahsiung, TW (2006 - 2007)
  • Kaoshiugh, TW (2011)
  • Kaohsiung, TW (2004 - 2024)

Company Filing History:


Years Active: 2003-2024

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Areas of Expertise:
Semiconductor Devices
Optical Sensors
Fingerprint Identification
Wafer Level Packaging
Thermally Enhanced Packages
Cathodic Protection
Integrated Circuit Chips
Bump Reliability
Microelectronics Packaging
Solder Ball Formation
Heat Dissipation
Fluxless Bumping
56 patents (USPTO):Explore Patents

Title: Inventor Hsin-Hui Lee: Revolutionizing Technology in Kaohsiung

Introduction: Hsin-Hui Lee is a visionary inventor based in Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Lee holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Lee has worked with leading tech companies and research institutions, spearheading projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Lee has collaborated with top scientists, engineers, and researchers globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hsin-Hui Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field of inventions.

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