The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Feb. 15, 2019
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Hsin-Hui Lee, Kaohsiung, TW;

Han-Liang Tseng, Hsinchu, TW;

Jiunn-Liang Yu, Taipei, TW;

Kwang-Ming Lin, Taichung, TW;

Yin Chen, Hsinchu, TW;

Si-Twan Chen, Jhubei, TW;

Hsueh-Jung Lin, Jhubei, TW;

Wen-Chih Lu, New Taipei, TW;

Ting-Jung Lu, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 27/146 (2006.01); H01L 27/32 (2006.01); H01L 31/0216 (2014.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14623 (2013.01); H01L 27/3232 (2013.01); H01L 29/78633 (2013.01); H01L 31/02162 (2013.01); H01L 31/02164 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.


Find Patent Forward Citations

Loading…