Company Filing History:
Years Active: 2007-2011
Title: Innovations of Ding-Chung Lu in Semiconductor Technology
Introduction
Ding-Chung Lu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for semiconductor device fabrication, which are crucial for advancing electronic components.
Latest Patents
Ding-Chung Lu's latest patents include a method for packaging a semiconductor device. This patent describes a substrate that comprises a plurality of dies, separated by scribe line areas. The method involves removing a portion of a layer within the scribe lines area using photolithography and etching to create openings. The substrate is then sawed along the scribe line areas, passing through these openings. Another notable patent involves interconnect structures with polygonal cell structures. This exemplary interconnect structure features a substrate and a first dielectric layer that exposes a conductive feature formed through it. The first dielectric layer includes multiple polygon cell structures with hollow interiors, enhancing the efficiency of the interconnects.
Career Highlights
Ding-Chung Lu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has positioned him as a key player in the development of advanced semiconductor technologies. His innovative approaches have contributed to the company's reputation for excellence in semiconductor manufacturing.
Collaborations
Ding-Chung Lu has collaborated with notable colleagues such as Chao-Hsiung Wang and Cheng-Yuan Tsai. These collaborations have fostered a productive environment for innovation and have led to significant advancements in semiconductor technology.
Conclusion
Ding-Chung Lu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of semiconductor devices and their applications.