The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Dec. 30, 2010
Tsang-yu Liu, Hsinchu, TW;
Yu-lin Yen, Taoyuan, TW;
Chuan-jin Shiu, Taoyuan, TW;
Po-shen Lin, Taipei, TW;
Tsang-Yu Liu, Hsinchu, TW;
Yu-Lin Yen, Taoyuan, TW;
Chuan-Jin Shiu, Taoyuan, TW;
Po-Shen Lin, Taipei, TW;
Other;
Abstract
The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.