The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Dec. 30, 2010
Ta-hsuan Lin, Chiayi, TW;
Chuan-jin Shiu, Taoyuan, TW;
Chia-ming Cheng, Taipei, TW;
Tsang-yu Liu, Hsinchu, TW;
Ta-Hsuan Lin, Chiayi, TW;
Chuan-Jin Shiu, Taoyuan, TW;
Chia-Ming Cheng, Taipei, TW;
Tsang-Yu Liu, Hsinchu, TW;
Other;
Abstract
The embodiment provides a package structure for a chip and a method for fabricating the same. The package structure for the chip includes a chip having a substrate and a bonding pad structure. The chip has an upper surface and a lower surface. An upper packaging layer covers the upper surface of the chip. A spacer layer is between the upper packaging layer and the chip. A conductive path is electrically connected to the bonding pad structure. An anti-reflective layer is disposed between the spacer layer and the upper packaging layer. An overlapping region is between the anti-reflective layer and the spacer layer.