Company Filing History:
1 out of 832,843 Years Active: 2014
Title: Innovations by Ta-Hsuan Lin: A Look into His Contributions to Chip Packaging
Introduction: Ta-Hsuan Lin is an inventive force hailing from Chiayi, Taiwan. With a strong focus on semiconductor technologies, he has contributed to the field of chip packaging, earning recognition for his innovative patent.
Latest Patents: Ta-Hsuan Lin holds a notable patent titled "Package structure for a chip and method for fabricating the same." This patent introduces a package structure designed to improve the integration and performance of chips. The invention comprises a chip with a substrate and a bonding pad structure, featuring an upper surface and a lower surface. A key aspect of the design includes an upper packaging layer that encapsulates the chip's upper surface, along with a spacer layer stationed between the upper packaging layer and chip. The conductive path is engineered to connect electrically to the bonding pad structure, with an anti-reflective layer positioned between the spacer layer and packaging layer. An overlapping region between these layers enhances efficacy, showcasing Lin’s innovative approach to chip fabrication.
Career Highlights: Throughout his career, Ta-Hsuan Lin has demonstrated a commitment to advancing semiconductor technologies. His inventiveness is exemplified in his patent work, which is pivotal to the evolution of chip packaging techniques. The critical nature of his development positions him as a valuable contributor to the industry.
Collaborations: Ta-Hsuan Lin has collaborated with esteemed colleagues, Chuan-Jin Shiu and Chia-Ming Cheng, who have worked alongside him to further innovations in semiconductor design and packaging. Together, they have shared insights and technical expertise that enhance their collective contributions to the field.
Conclusion: Ta-Hsuan Lin’s innovations in chip packaging redefine aspects of semiconductor technology. His patent not only underscores his skill as an inventor but also serves as a testament to the collaborative spirit shared among inventors in driving progress within the industry. As technology evolves, Lin’s contributions will undoubtedly continue to influence future developments in chip fabrication and packaging.