The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Sep. 01, 2011
Tzu-hsiang Hung, Kaohsiung, TW;
Hsin-chih Chiu, New Taipei, TW;
Chuan-jin Shiu, Zhongli, TW;
Chia-sheng Lin, Zhongli, TW;
Yen-shih Ho, Kaohsiung, TW;
Yu-min Liang, Zhongli, TW;
Tzu-Hsiang Hung, Kaohsiung, TW;
Hsin-Chih Chiu, New Taipei, TW;
Chuan-Jin Shiu, Zhongli, TW;
Chia-Sheng Lin, Zhongli, TW;
Yen-Shih Ho, Kaohsiung, TW;
Yu-Min Liang, Zhongli, TW;
Other;
Abstract
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed between the protection layer and the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on the protection layer, wherein the light shielding layer does not contact with the conducting bump.