Chien-Min Lin

Title: Chien-Min Lin: Innovator in Chip Packaging Technology

Introduction

Chien-Min Lin is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 5 patents. His innovative designs and methods have advanced the efficiency and functionality of chip packages in the electronics industry.

Latest Patents

One of Chien-Min Lin's latest patents is titled "Chip package and manufacturing method thereof." This invention describes a chip package that includes a chip, a sidewall structure with a first and second light-shielding layer, and a cover. The chip features a light emitter and a light receiver located on its top surface. The sidewall structure surrounds these components and includes two aperture areas for the light emitter and receiver. The design ensures that at least one surface of the sidewall structure has a light-shielding layer, enhancing the performance of the chip package.

Another notable patent by Lin is also titled "Chip package and manufacturing method thereof." This invention involves a chip package that consists of a chip, an adhesive layer, and a dam element. The chip has a sensing area on its first surface, which is covered by the adhesive layer. The dam element surrounds the sensing area and has a rough surface, with a thickness ranging from 20 µm to 750 µm. This design improves the reliability and effectiveness of the chip's sensing capabilities.

Career Highlights

Chien-Min Lin is currently employed at Xintec Corporation, where he continues to innovate in the field of chip packaging. His work has been instrumental in developing advanced technologies that meet the growing demands of the electronics market.

Collaborations

Throughout his career, Lin has collaborated with talented individuals such as Yen-Shih Ho and Po-Han Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chien-Min Lin is a distinguished inventor whose contributions to chip packaging technology have made a lasting impact on the industry. His innovative patents and collaborative efforts continue to drive advancements in electronics.