The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Jan. 04, 2021
Xintec Inc., Taoyuan, TW;
Chia-Ming Cheng, New Taipei, TW;
Shu-Ming Chang, New Taipei, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive sheet is disposed over the first light-transmissive sheet. The first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet. The redistribution layer is disposed on the inclined sidewall of the first light-transmissive sheet, and is in contact with an end of the first antenna layer.