The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Feb. 08, 2021
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Chia-Ming Cheng, New Taipei, TW;
Shu-Ming Chang, New Taipei, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 25/50 (2013.01); B81B 7/008 (2013.01);
Abstract
A chip package includes a first chip, a second chip, a first molding compound, and a first distribution line. The second chip vertically or laterally overlaps the first chip. The second chip has a conductive pad. The first molding compound covers the first and second chips, and surrounds the second chip. The first molding compound has a first through hole. The conductive pad is in the first through hole. The first distribution line is located on a surface of the first molding compound facing away from the second chip, and electrically connects the conductive pad in the first through hole.