Wei-Ming Chien

Title: **Innovations of Wei-Ming Chien: A Trailblazer in Chip Packaging Technology**

Introduction

Wei-Ming Chien, an accomplished inventor based in Taoyuan, Taiwan, has made significant contributions to the field of chip packaging technology. With a total of nine patents to his name, Chien's innovative designs and methodologies have revolutionized the way chip packages are conceptualized and manufactured.

Latest Patents

Among his latest patents are two notable innovations:

1. **Chip package and manufacturing method thereof** - This invention features a chip package that integrates a chip with a conductive structure. A unique aspect of this design is that a first surface of the chip contains a photodiode, while its second surface allows for alignment with a recess designed specifically for the photodiode. The conductive structure enhances the functionality of the chip, showcasing Chien's commitment to advancing packaging technologies.

2. **Chip package and power module** - This patent outlines a sophisticated chip package that includes a high-voltage withstanding substrate alongside a device chip. The substrate's structure comprises a main body, a functional layer, and a grounding layer. Notably, the main body is engineered with a through-hole that connects the top and bottom surfaces, enhancing electrical connectivity and stability within the device. This power module represents a significant step forward in ensuring reliability and performance in high-voltage applications.

Career Highlights

Wei-Ming Chien's career has been marked by his dedication to innovation in chip packaging. Working at Xintec Corporation, he has collaborated with accomplished professionals like Tsang-Yu Liu and Po-Han Lee, all contributing their expertise to develop cutting-edge technologies. Chien’s relentless pursuit of innovation has positioned him as a leader within his field.

Collaborations

Chien's collaborations with colleagues such as Tsang-Yu Liu and the talented engineer Po-Han Lee underscore the synergy and teamwork that drive innovation at Xintec Corporation. By working alongside experienced professionals, Chien enhances his ability to push the boundaries of technology, ensuring the development of advanced solutions in chip packaging.

Conclusion

In conclusion, Wei-Ming Chien stands out as a visionary inventor whose contributions to chip packaging technology have left a lasting impact. With his nine patents and ongoing collaborations, Chien continues to drive innovation within the industry, paving the way for future advancements. His work at Xintec Corporation exemplifies the power of creativity and collaboration in addressing the challenges of modern technology.