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Globalwafers Japan Co., Ltd.

USPTO Granted Patents = 22

EPO Patents = 6

Forward Citations = 12

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51 inventors (with patents filed for the assignee):

Koji Araki (8 out of 10 patents)

Haruo Sudo (7 out of 9 patents)

Tatsuhiko Aoki (7 out of 9 patents)

4. Takeshi Senda (6 out of 13 patents)

5. Koji Izunome (4 out of 14 patents)

6. Shingo Narimatsu (4 out of 4 patents)

7. Susumu Maeda (4 out of 12 patents)

8. Hiromichi Isogai (3 out of 9 patents)

9. Kazuhiko Kashima (3 out of 11 patents)

10. Takashi Ishikawa (3 out of 9 patents)

11. Hironori Banba (3 out of 42 patents)

12. Tetsuo Endoh (2 out of 105 patents)

13. Hideyuki Okamura (2 out of 2 patents)

14. Koji Sueoka (2 out of 2 patents)

15. Nobue Araki (2 out of 2 patents)

22 patents: Sort by Forward Citations

1. 12488979 - Lamination wafers and method of producing bonded wafers using the same (2025-12-02),

2. 12378695 - Method for heat-treating silicon wafer (2025-08-05),

3. 12371813 - Silicon wafer and method for producing silicon wafer (2025-07-29),

4. 12308228 - Manufacturing method for semiconductor silicon wafer (2025-05-20),

5. 12084785 - Method and apparatus for pulling single crystal (2024-09-10),

6. 12046469 - Manufacturing method for semiconductor silicon wafer (2024-07-23),

7. 11887845 - Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrate (2024-01-30),

8. 11754497 - Method for measuring extremely low oxygen concentration in silicon wafer (2023-09-12),

9. 11538721 - Evaluation method of metal contamination (2022-12-27),

10. 11162191 - Thermal processing method for silicon wafer (2021-11-02),

11. 11060983 - Evaluation method of silicon wafer (2021-07-13),

12. 10916421 - Method of manufacturing epitaxial silicon wafers (2021-02-09),

13. 10840089 - Protective-film forming method for semiconductor substrate (2020-11-17),

14. 10648101 - Silicon wafer (2020-05-12),

15. 10330599 - Calibration curve determination method, carbon concentration measurement method, and silicon wafer-manufacturing method (2019-06-25),

GLOBALWAFERS JAPAN CO., LTD. is a leading provider of semiconductor wafer manufacturing services. With a focus on delivering high-quality products and innovative solutions, the company offers a wide range of wafer solutions to global customers. Their state-of-the-art facilities and advanced technologies enable them to produce cutting-edge semiconductor wafers for various applications. GLOBALWAFERS JAPAN CO., LTD. is committed to driving the growth of the semiconductor industry and meeting the evolving needs of their customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

22 Patents

#7 in Niigata

#2,724 in Japan

#27,863 in the World

Globalwafers Japan Co., Ltd.

Forward Citations = 12

51 inventors:

Koji Araki (8 out of 10 patents)

Haruo Sudo (7 out of 9 patents)

Tatsuhiko Aoki (7 out of 9 patents)

4. Takeshi Senda (6 out of 13 patents)

5. Koji Izunome (4 out of 14 patents)

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