The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

Aug. 02, 2018
Applicant:

Globalwafers Japan Co., Ltd., Niigata, JP;

Inventors:

Nobue Araki, Niigata, JP;

Takeshi Onozuka, Niigata, JP;

Tomoyuki Ishihara, Niigata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); C30B 15/14 (2006.01); C30B 15/20 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); G01N 21/64 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); C30B 15/14 (2013.01); C30B 15/203 (2013.01); G01N 21/6408 (2013.01); G01N 21/6489 (2013.01); H01J 37/32073 (2013.01); H01L 21/02104 (2013.01); H01L 22/22 (2013.01); H01J 2237/24592 (2013.01);
Abstract

A method of evaluating metal contamination by measuring the amount of metal contaminants to a silicon wafer in a rapid thermal processing apparatus includes steps of obtaining a Si single crystal grown by the Czochralski method at a pulling rate of 1.0 mm/min or lower, the crystal having oxygen concentration of 1.3×10atoms/cmor less, slicing silicon wafers from the Si single crystal except regions of 40 mm toward the central portion from the head of the single crystal and 40 mm toward the central portion from the tail, heat-treating the silicon wafer with a rapid thermal processing apparatus and transferring contaminants from members in a furnace of the rapid thermal processing apparatus to the silicon wafer, and measuring a lifetime of the silicon wafer to which contaminants are transferred.


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