Koji Sueoka

Title: Innovations of Koji Sueoka in Silicon Wafer Processing

Introduction

Koji Sueoka is a notable inventor based in Okayama, Japan, recognized for his contributions to the field of silicon wafer processing. With a total of two patents to his name, he has made significant advancements that enhance the efficiency and quality of silicon wafers used in various applications.

Latest Patents

One of his latest patents is a thermal processing method for silicon wafers. This method involves a processing temperature between 1250°C and 1350°C, with a cooling rate ranging from 20°C/s to 150°C/s. The thermal processing is conducted by adjusting the processing temperature and cooling rate within specific limits of oxygen partial pressure in the thermal processing atmosphere. Another patent focuses on the structure of a silicon wafer, which includes a denuded zone characterized by a low density of vacancy-oxygen complexes. This innovative design features an intermediate layer that gradually increases in density towards the bulk layer, optimizing the wafer's performance.

Career Highlights

Koji Sueoka is currently employed at Globalwafers Japan Co., Ltd., where he continues to develop cutting-edge technologies in silicon wafer processing. His work has been instrumental in improving the manufacturing processes and quality of silicon wafers, which are critical components in the semiconductor industry.

Collaborations

Throughout his career, Koji has collaborated with esteemed colleagues such as Susumu Maeda and Hironori Banba. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Koji Sueoka's contributions to silicon wafer processing through his patents and collaborative efforts highlight his role as a significant inventor in the field. His work continues to influence advancements in semiconductor technology, showcasing the importance of innovation in this industry.