The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Mar. 23, 2017
Globalwafers Japan Co., Ltd., Niigata, JP;
Susumu Maeda, Niigata, JP;
Hironori Banba, Niigata, JP;
Haruo Sudo, Niigata, JP;
Hideyuki Okamura, Niigata, JP;
Koji Araki, Niigata, JP;
Koji Sueoka, Okayama, JP;
Kozo Nakamura, Okayama, JP;
GLOBALWAFERS JAPAN CO., LTD., Niigata, JP;
Abstract
A processing temperature Tby a rapid thermal processing furnace is 1250° C. or more and 1350° C. or less, and a cooling rate Rfrom the processing temperature is in a range of 20° C./s or more and 150° C./s or less, and thermal processing is performed by adjusting the processing temperature Tand the cooling rate Rwithin a range between the upper limit P=0.00207T·R−2.52R+13.3 (Formula (A)) and the lower limit P=0.000548T·R−0.605R−0.511 (Formula (B)) of an oxygen partial pressure P in a thermal processing atmosphere.