Susumu Maeda

Title: The Innovations of Susumu Maeda

Introduction

Susumu Maeda is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the processing of silicon wafers. With a total of 12 patents to his name, Maeda's work has had a substantial impact on the industry.

Latest Patents

One of Maeda's latest patents is a thermal processing method for silicon wafers. This method involves a processing temperature between 1250°C and 1350°C, with a cooling rate ranging from 20°C/s to 150°C. The thermal processing is performed by adjusting the processing temperature and cooling rate within specific limits of oxygen partial pressure in the thermal processing atmosphere. Another notable patent describes a silicon wafer that includes a denuded zone, characterized by a low density of vacancy-oxygen complexes. This wafer design features an intermediate layer that gradually increases in density inwardly, along with a bulk layer that has a higher density of vacancy-oxygen complexes.

Career Highlights

Throughout his career, Susumu Maeda has worked with several notable companies, including GlobalWafers Japan Co., Ltd. and Komatsu Denshi Kinzoku Kabushiki Kaisha. His experience in these organizations has allowed him to refine his expertise in semiconductor processing and innovation.

Collaborations

Maeda has collaborated with several professionals in his field, including Koji Araki and Haruo Sudo. These collaborations have contributed to the advancement of technology in silicon wafer processing.

Conclusion

Susumu Maeda's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements.