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Covalent Materials Corporation

USPTO Granted Patents = 35

EPO Patents = 3

Trademarks = 3

Forward Citations = 663

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88 inventors (with patents filed for the assignee):

Jun Komiyama (6 out of 16 patents)

Yoshihisa Abe (5 out of 16 patents)

Koji Izunome (5 out of 14 patents)

4. Shunichi Suzuki (5 out of 35 patents)

5. Hiroshi Oishi (4 out of 12 patents)

6. Takeshi Senda (4 out of 13 patents)

7. Akira Yoshida (3 out of 114 patents)

8. Kenichi Eriguchi (3 out of 11 patents)

9. Mitsuhiro Fujita (3 out of 18 patents)

10. Masaki Irie (3 out of 6 patents)

11. Eiji Toyoda (3 out of 5 patents)

12. Hiromichi Isogai (3 out of 9 patents)

13. Kazuhiko Kashima (3 out of 11 patents)

14. Kumiko Murayama (3 out of 4 patents)

15. Susumu Maeda (3 out of 12 patents)

35 patents: Sort by Forward Citations

1. 9139448 - Heat-insulating material (2015-09-22),

2. 9096826 - Culture substrate and culture method for undifferentiated cell and undifferentiated cultured cell (2015-08-04),

3. 9086321 - Method of analyzing nitride semiconductor layer and method of manufacturing nitride semiconductor substrate using the analysis method (2015-07-21),

4. 9045691 - Ceramics composite (2015-06-02),

5. 8940390 - Ceramics composite (2015-01-27),

6. 8785942 - Nitride semiconductor substrate and method of manufacturing the same (2014-07-22),

7. 8691367 - Micro channel structure body and method of manufacturing micro channel structure body (2014-04-08),

8. 8673638 - Cell culture support and cell culture method (2014-03-18),

9. 8399341 - Method for heat treating a silicon wafer (2013-03-19),

10. 8252700 - Method of heat treating silicon wafer (2012-08-28),

11. 8216921 - Method for production of silicon wafer for epitaxial substrate and method for production of epitaxial substrate (2012-07-10),

12. 8212288 - Compound semiconductor substrate comprising a multilayer buffer layer (2012-07-03),

13. 8206623 - Process for producing ceramic fine particles, and ceramic fine particle producing apparatus used therein (2012-06-26),

14. 8186380 - Decompression apparatus and inorganic porous body (2012-05-29),

15. 8148753 - Compound semiconductor substrate having multiple buffer layers (2012-04-03),

Covalent Materials Corporation is a leading global supplier of advanced materials and components. We specialize in the development, manufacture, and distribution of high-performance materials for various industries, including automotive, aerospace, electronics, and renewable energy. With a strong focus on innovation and technology, we strive to provide our customers with cutting-edge solutions that meet their specific needs. Visit our website for more information about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

35 Patents

#867 in Tokyo

#2,074 in Japan

#18,581 in the World

Covalent Materials Corporation

Forward Citations = 663

88 inventors:

Jun Komiyama (6 out of 16 patents)

Yoshihisa Abe (5 out of 16 patents)

Koji Izunome (5 out of 14 patents)

4. Shunichi Suzuki (5 out of 35 patents)

5. Hiroshi Oishi (4 out of 12 patents)

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