Niigata, Japan

Eiji Toyoda


Average Co-Inventor Count = 9.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2011-2015

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5 patents (USPTO):Explore Patents

Title: Eiji Toyoda: Innovator in Silicon Wafer Technology

Introduction

Eiji Toyoda is a prominent inventor based in Niigata, Japan. He has made significant contributions to the field of silicon wafer technology, holding a total of five patents. His work focuses on improving the quality and performance of silicon wafers used in various electronic devices.

Latest Patents

Among his latest patents, Toyoda has developed a silicon wafer and a method for heat-treating silicon wafers. This innovation aims to prevent void defects in the bulk region of the wafer, which can lead to contamination and slip generation during device processing. The patented heat-treating method reduces crystal defects, such as COP, in the region near the wafer surface, ensuring a defect-free surface region and a bulk region that includes a polyhedron-shaped void defect. Additionally, he has patented a method for manufacturing single crystal silicon wafers from ingots grown by the Czochralski process, utilizing a rapid heating and cooling process to enhance the wafer's properties.

Career Highlights

Eiji Toyoda has worked with notable companies in the semiconductor industry, including Covalent Materials Corporation and GlobalWafers Japan Co., Ltd. His experience in these organizations has allowed him to refine his expertise in silicon wafer technology and contribute to advancements in the field.

Collaborations

Throughout his career, Toyoda has collaborated with esteemed colleagues such as Hiromichi Isogai and Takeshi Senda. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Eiji Toyoda's contributions to silicon wafer technology have had a lasting impact on the semiconductor industry. His innovative patents and collaborations highlight his dedication to advancing the field and improving the quality of electronic devices.

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