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Aurora, IL, United States of America

Cmc Materials, Inc.

USPTO Granted Patents = 35

EPO Patents = 54

Trademarks = 22

Forward Citations = 4

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76 inventors (with patents filed for the assignee):

Roman A Ivanov (6 out of 17 patents)

Kevin P Dockery (5 out of 22 patents)

Fernando Hung Low (5 out of 6 patents)

4. Brian Reiss (5 out of 24 patents)

5. Steven Kraft (5 out of 12 patents)

6. Steven Grumbine (4 out of 62 patents)

7. Paul Andre Lefevre (4 out of 14 patents)

8. Alexander W Hains (4 out of 10 patents)

9. Sarah Brosnan (4 out of 7 patents)

10. Chen-Chih Tsai (4 out of 5 patents)

11. Deepak Shukla (3 out of 94 patents)

12. Ji Cui (3 out of 21 patents)

13. Helin Huang (3 out of 7 patents)

14. Pankaj K Singh (3 out of 9 patents)

15. Ping Huang (3 out of 17 patents)

35 patents: Sort by Forward Citations

1. 12679997 - Amine-based compositions for use in CMP with high polysilicon rate (2026-07-14),

2. 12528973 - Composition and method for silicon oxide and carbon doped silicon oxide CMP (2026-01-20),

3. 12473457 - Composition for tungsten CMP (2025-11-18),

4. 12472602 - Textured CMP pad comprising polymer particles (2025-11-18),

5. 12466979 - CMP composition including anionic and cationic inhibitors (2025-11-11),

6. 12459076 - Chemical-mechanical polishing subpad having porogens with polymeric shells (2025-11-04),

7. 12428580 - CMP composition including an anionic abrasive (2025-09-30),

8. 12398293 - Composition and method for polishing boron doped polysilicon (2025-08-26),

9. 12338369 - Nitride inhibitors for high selectivity of TiN—SiN CMP applications (2025-06-24),

10. 12269969 - Polishing composition and method with high selectivity for silicon nitride and polysilicon over silicon oxide (2025-04-08),

11. 12234382 - CMP composition including anionic and cationic inhibitors (2025-02-25),

12. 12227673 - Composition and method for silicon nitride CMP (2025-02-18),

13. 12157834 - Composition and method for polysilicon CMP (2024-12-03),

14. 12116502 - Self-stopping polishing composition and method for high topological selectivity (2024-10-15),

15. 11938584 - Chemical mechanical planarization pads with constant groove volume (2024-03-26),

CMC Materials, Inc. is a global leader in the development and production of high-performance materials used in various industries such as semiconductor manufacturing, electronic components, and photovoltaics. With over 50 years of experience, CMC Materials offers a comprehensive range of chemical mechanical planarization (CMP) slurries, polishing pads, and other materials that enable the precise fabrication and finishing of advanced devices. Their innovative solutions contribute to enhancing the performance and reliability of semiconductors, integrated circuits, and other electronic components that power today's technology-driven world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Cmc Materials, Inc.

35 Patents

#10 in Aurora, IL

#538 in Illinois

#9,734 in US

#19,126 in the World

Aurora, IL, United States of America

Cmc Materials, Inc.

Forward Citations = 4

76 inventors:

Roman A Ivanov (6 out of 17 patents)

Kevin P Dockery (5 out of 22 patents)

Fernando Hung Low (5 out of 6 patents)

4. Brian Reiss (5 out of 24 patents)

5. Steven Kraft (5 out of 12 patents)

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