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Aurora, IL, United States of America

Cmc Materials, Inc.

USPTO Granted Patents = 35

EPO Patents = 54

Trademarks = 22

Forward Citations = 4

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76 inventors (with patents filed for the assignee):

Roman A Ivanov (6 out of 17 patents)

Kevin P Dockery (5 out of 22 patents)

Fernando Hung Low (5 out of 6 patents)

4. Brian Reiss (5 out of 24 patents)

5. Steven Kraft (5 out of 12 patents)

6. Steven Grumbine (4 out of 62 patents)

7. Paul Andre Lefevre (4 out of 14 patents)

8. Alexander W Hains (4 out of 10 patents)

9. Sarah Brosnan (4 out of 7 patents)

10. Chen-Chih Tsai (4 out of 5 patents)

11. Deepak Shukla (3 out of 94 patents)

12. Ji Cui (3 out of 21 patents)

13. Helin Huang (3 out of 7 patents)

14. Pankaj K Singh (3 out of 9 patents)

15. Ping Huang (3 out of 17 patents)

Core Competencies:

CMP Compositions

Polishing Pads

Silicon Oxide

Polysilicon

Tungsten CMP

Chemical-Mechanical Planarization

Abrasive Particles

Solid Polymer Electrolyte

Nickel Substrate

UV-Curable Resins

Textured CMP Pad

Alternative Oxidizing Agents

35 patents: Sort by Forward Citations

1. 12679997 - Amine-based compositions for use in CMP with high polysilicon rate (2026-07-14),

2. 12528973 - Composition and method for silicon oxide and carbon doped silicon oxide CMP (2026-01-20),

3. 12473457 - Composition for tungsten CMP (2025-11-18),

4. 12472602 - Textured CMP pad comprising polymer particles (2025-11-18),

5. 12466979 - CMP composition including anionic and cationic inhibitors (2025-11-11),

6. 12459076 - Chemical-mechanical polishing subpad having porogens with polymeric shells (2025-11-04),

7. 12428580 - CMP composition including an anionic abrasive (2025-09-30),

8. 12398293 - Composition and method for polishing boron doped polysilicon (2025-08-26),

9. 12338369 - Nitride inhibitors for high selectivity of TiN—SiN CMP applications (2025-06-24),

10. 12269969 - Polishing composition and method with high selectivity for silicon nitride and polysilicon over silicon oxide (2025-04-08),

11. 12234382 - CMP composition including anionic and cationic inhibitors (2025-02-25),

12. 12227673 - Composition and method for silicon nitride CMP (2025-02-18),

13. 12157834 - Composition and method for polysilicon CMP (2024-12-03),

14. 12116502 - Self-stopping polishing composition and method for high topological selectivity (2024-10-15),

15. 11938584 - Chemical mechanical planarization pads with constant groove volume (2024-03-26),

Company Overview

Cmc Materials, Inc. is a leading provider of advanced materials and solutions for the semiconductor and other high-tech industries. The company specializes in the development and manufacturing of chemical mechanical planarization (CMP) slurries, polishing pads, and other materials essential for the fabrication of integrated circuits. With a strong focus on innovation and quality, Cmc Materials serves a global customer base, contributing to advancements in technology and manufacturing processes across various sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

35 Patents

#10 in Aurora, IL

#539 in Illinois

#9,749 in US

#19,168 in the World

Aurora, IL, United States of America

Cmc Materials, Inc.

Forward Citations = 4

76 inventors:

Roman A Ivanov (6 out of 17 patents)

Kevin P Dockery (5 out of 22 patents)

Fernando Hung Low (5 out of 6 patents)

4. Brian Reiss (5 out of 24 patents)

5. Steven Kraft (5 out of 12 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Cmc Materials, Inc.. Retrieved from https://idiyas.com/company/cmc-materials

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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