The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Nov. 10, 2022
Applicant:

Cmc Materials Llc, Aurora, IL (US);

Inventors:

Julianne Truffa, Aurora, IL (US);

Brittany Johnson, Aurora, IL (US);

Alexander W. Hains, Aurora, IL (US);

Elliot Knapton, Aurora, IL (US);

Brian Reiss, Aurora, IL (US);

Assignee:

CMC MATERIALS LLC, Aurora, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H10P 52/40 (2026.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H10P 52/402 (2026.01); H10P 52/403 (2026.01);
Abstract

The invention provides a chemical-mechanical polishing composition comprising: (a) silica abrasive; (b) an amine-based compound, wherein the amine-based compound comprises a carbon to nitrogen ratio of about 1:1 to about 3:1; (c) optionally a buffer; and (d) water, wherein the polishing composition has a pH of about 9 to about 12. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising polysilicon, using the inventive polishing composition.


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