Naperville, IL, United States of America

Chen-Chih Tsai

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 4.6

ph-index = 1


Company Filing History:


Years Active: 2020-2025

where 'Filed Patents' based on already Granted Patents

5 patents (USPTO):

Title: Innovations of Inventor Chen-Chih Tsai in Chemical Mechanical Planarization

Introduction

Chen-Chih Tsai, an accomplished inventor based in Naperville, IL, has made significant contributions to the field of chemical mechanical planarization (CMP) with a total of four patents to his name. His work particularly focuses on advancements in polishing pads used in semiconductor manufacturing, enhancing both efficiency and performance.

Latest Patents

Among Chen-Chih Tsai’s latest innovations is a patent for "Chemical mechanical planarization pads via vat-based production." This invention describes a CMP pad made using a vat-based additive manufacturing process, where the polishing portion consists of a polymer material with a distinct elastic modulus. Notably, it details how the backing portion of the pad may have an elastic modulus less than that of the polishing portion.

Another significant patent from Tsai is for "Polishing pad employing polyamine and cyclohexanedimethanol curatives." This state-of-the-art CMP pad includes a thermosetting polyurethane polishing layer featuring an isocyanate-terminated urethane prepolymer combined with polyamine and cyclohexanedimethanol curatives. The specific molar ratio of these curatives demonstrates Tsai’s innovative approach to enhancing polishing pad formulations.

Career Highlights

Chen-Chih Tsai's career is distinguished by substantial roles in prominent companies such as CMC Materials, Inc. and Cabot Microelectronics Corporation. His experiences and expertise in the materials sector have propelled him to the forefront of innovation in CMP technologies, allowing him to develop solutions that address the evolving needs of the semiconductor industry.

Collaborations

Throughout his journey, Tsai has collaborated with notable professionals in his field, including Eric S. Moyer and Ping Huang. These partnerships have played a crucial role in expanding the boundaries of research and development in polishing technologies, leading to successful patent applications.

Conclusion

In summary, Chen-Chih Tsai stands out as a significant contributor to chemical mechanical planarization through his innovative patents and collaborative efforts in the industry. His work continues to influence the field, promising advancements that cater to the modern demands of semiconductor manufacturing.

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