The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
May. 07, 2020
Cabot Microelectronics Corporation, Aurora, IL (US);
Eric S. Moyer, Aurora, IL (US);
Lin Fu, Rancho Palos Verdes, CA (US);
William Michael Spitzig, Lake Oswego, OR (US);
Chen-Chih Tsai, Naperville, IL (US);
Ping Huang, Beaverton, OR (US);
Justin Stewart, Aurora, IL (US);
Carlos Barros, West Chicago, IL (US);
CMC MATERIALS, INC., Aurora, IL (US);
Abstract
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.