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For the Inventor, By the Inventor

Beaverton, OR, United States of America

Ping Huang

This inventor holds 17 USPTO granted patents and 1 published patent application and 10 EPO patents. Top assignees: Nexplanar Corporation, Cmc Materials, Inc., Cabot Microelectronics Corporation. Active years: 2013-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ping Huang. Retrieved from https://idiyas.com/inventor/ping-huang-uorrpevz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 154(Granted Patents)


Location History:

  • St. Louis Park, MN (US) (2015)
  • Eden Prairie, MN (US) (2013 - 2017)
  • Beaverton, OR (US) (2015 - 2023)
  • Naperville, IL (US) (2023)

Company Filing History:

goldMedal12 out of 33 
 
Nexplanar Corporation
 patents
silverMedal3 out of 35 
 
Cmc Materials, Inc.
 patents
bronzeMedal2 out of 297 
 
Cabot Microelectronics Corporation
 patents

Years Active: 2013-2023

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17 patents (USPTO):Explore Patents
1. 11845157 - Chemical mechanical planarization pads via vat-based production (2023-12-19),
2. 11807710 - UV-curable resins used for chemical mechanical polishing pads (2023-11-07),
3. 10946495 - Low density polishing pad (2021-03-16),
4. 10293459 - Polishing pad having polishing surface with continuous protrusions (2019-05-21),
5. 10160092 - Polishing pad having polishing surface with continuous protrusions having tapered sidewalls (2018-12-25),
6. 9649742 - Polishing pad having polishing surface with continuous protrusions (2017-05-16),
7. 9597777 - Homogeneous polishing pad for eddy current end-point detection (2017-03-21),
8. 9597769 - Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer (2017-03-21),
9. 9555518 - Polishing pad with multi-modal distribution of pore diameters (2017-01-31),
10. 9296085 - Polishing pad with homogeneous body having discrete protrusions thereon (2016-03-29),
11. 9156124 - Soft polishing pad for polishing a semiconductor substrate (2015-10-13),
12. 9028302 - Polishing pad for eddy current end-point detection (2015-05-12),
13. 9017140 - CMP pad with local area transparency (2015-04-28),
14. 8702479 - Polishing pad with multi-modal distribution of pore diameters (2014-04-22),
15. 8657653 - Homogeneous polishing pad for eddy current end-point detection (2014-02-25),

Title: The Innovative Contributions of Inventor Ping Huang

Introduction

Ping Huang, an accomplished inventor based in Beaverton, OR, has made significant strides in the field of chemical mechanical polishing (CMP) technology. With a remarkable portfolio of 17 patents, his innovations focus on enhancing the efficiency and effectiveness of CMP pads, crucial components in semiconductor manufacturing.

Latest Patents

Huang's latest patents showcase his commitment to advancing CMP technology. One of his notable inventions is a novel CMP pad created through a vat-based additive manufacturing process. This innovative pad consists of a polishing portion made from a polymer material with a specific elastic modulus, designed to optimize polishing performance. Additionally, their backing portion features a distinct elastic modulus that is less than that of the polishing portion, promoting greater adaptability during the polishing process.

Another significant patent introduces a UV-curable resin intended for the formulation of CMP pads. This resin incorporates components such as acrylate blocked isocyanates, acrylate monomers, and a photoinitiator, ultimately offering a more efficient method for creating CMP pads. This invention reflects Huang's deep understanding of material science and its applications within the semiconductor industry.

Career Highlights

Throughout his career, Ping Huang has worked with various esteemed companies, including Nexplanar Corporation and CMC Materials, Inc. His experiences at these organizations have contributed to his expertise in CMP technologies and have enabled him to develop groundbreaking solutions that cater to the evolving needs of the semiconductor manufacturing landscape.

Collaborations

Huang has collaborated with notable professionals in the field, including William C. Allison and Diane Scott. These partnerships have facilitated the exchange of ideas and fostered innovation, further enhancing the quality and applicability of his inventions.

Conclusion

With 17 patents to his name and ongoing contributions to CMP technology, Ping Huang stands as a significant figure in the realm of semiconductor manufacturing. His innovative mindset and commitment to excellence continue to drive advancements that will shape the future of this critical industry. As technology evolves, so too will Huang's pioneering inventions, leaving a lasting impact on the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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