Beaverton, OR, United States of America

Ping Huang

USPTO Granted Patents = 17 

 

Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 153(Granted Patents)


Location History:

  • St. Louis Park, MN (US) (2015)
  • Eden Prairie, MN (US) (2013 - 2017)
  • Beaverton, OR (US) (2015 - 2023)
  • Naperville, IL (US) (2023)

Company Filing History:


Years Active: 2013-2023

where 'Filed Patents' based on already Granted Patents

17 patents (USPTO):

Title: The Innovative Contributions of Inventor Ping Huang

Introduction

Ping Huang, an accomplished inventor based in Beaverton, OR, has made significant strides in the field of chemical mechanical polishing (CMP) technology. With a remarkable portfolio of 17 patents, his innovations focus on enhancing the efficiency and effectiveness of CMP pads, crucial components in semiconductor manufacturing.

Latest Patents

Huang's latest patents showcase his commitment to advancing CMP technology. One of his notable inventions is a novel CMP pad created through a vat-based additive manufacturing process. This innovative pad consists of a polishing portion made from a polymer material with a specific elastic modulus, designed to optimize polishing performance. Additionally, their backing portion features a distinct elastic modulus that is less than that of the polishing portion, promoting greater adaptability during the polishing process.

Another significant patent introduces a UV-curable resin intended for the formulation of CMP pads. This resin incorporates components such as acrylate blocked isocyanates, acrylate monomers, and a photoinitiator, ultimately offering a more efficient method for creating CMP pads. This invention reflects Huang's deep understanding of material science and its applications within the semiconductor industry.

Career Highlights

Throughout his career, Ping Huang has worked with various esteemed companies, including Nexplanar Corporation and CMC Materials, Inc. His experiences at these organizations have contributed to his expertise in CMP technologies and have enabled him to develop groundbreaking solutions that cater to the evolving needs of the semiconductor manufacturing landscape.

Collaborations

Huang has collaborated with notable professionals in the field, including William C. Allison and Diane Scott. These partnerships have facilitated the exchange of ideas and fostered innovation, further enhancing the quality and applicability of his inventions.

Conclusion

With 17 patents to his name and ongoing contributions to CMP technology, Ping Huang stands as a significant figure in the realm of semiconductor manufacturing. His innovative mindset and commitment to excellence continue to drive advancements that will shape the future of this critical industry. As technology evolves, so too will Huang's pioneering inventions, leaving a lasting impact on the field.

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