The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Jan. 10, 2014
Applicant:
Nexplanar Corporation, Hillsboro, OR (US);
Inventors:
William C. Allison, Beaverton, OR (US);
Diane Scott, Portland, OR (US);
Ping Huang, Beaverton, OR (US);
Richard Frentzel, Murrieta, OR (US);
Alexander William Simpson, Hillsboro, OR (US);
Assignee:
NexPlanar Corporation, Hillsboro, OR (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24B 37/013 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24D 11/003 (2013.01); B24B 37/013 (2013.01); B24B 37/205 (2013.01);
Abstract
Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.