Beaverton, OR, United States of America

William C Allison

USPTO Granted Patents = 26 

 

Average Co-Inventor Count = 4.3

ph-index = 9

Forward Citations = 253(Granted Patents)


Company Filing History:


Years Active: 2013-2021

where 'Filed Patents' based on already Granted Patents

26 patents (USPTO):

Title: William C. Allison: Innovator in Polishing Pad Technologies

Introduction

William C. Allison is an accomplished inventor based in Beaverton, Oregon, with an impressive portfolio of 26 patents to his name. His innovations primarily focus on polishing pads and methods that enhance substrate finishing processes. His contributions have significantly impacted the manufacturing and semiconductor industries.

Latest Patents

Among his latest inventions, William has developed a low-density polishing pad that offers enhanced performance in substrate polishing applications. This polishing pad features a density ranging from approximately 0.4 to 0.55 g/cc and combines a thermoset polyurethane material with a unique structure of closed-cell pores. Each of these pores is surrounded by a shell made from an acrylic co-polymer, contributing to the pad's effective polishing capabilities.

Another noteworthy patent is for polishing pads that possess a polishing surface with continuous protrusions. This innovative design aids in improving the consistency and efficiency of the polishing process. William's methods of fabricating both types of polishing pads reflect a commitment to innovation in substrate processing technology.

Career Highlights

Throughout his career, William has made significant contributions while working with prominent companies in the industry. He has been associated with Nexplanar Corporation and Cabot Microelectronics Corporation, where he has leveraged his expertise in polishing materials and processes to create advanced solutions for customers.

Collaborations

William has collaborated with exceptional colleagues such as Diane Scott and Ping Huang, who share his passion for innovation. Their teamwork has been instrumental in advancing the technologies surrounding polishing pads and enhancing their applications.

Conclusion

William C. Allison's research and inventions are pivotal to the field of substrate polishing technology. His 26 patents and continued innovations signify his dedication to developing effective solutions within the semiconductor and manufacturing industries. As a leading inventor, his impact on polishing pad technology will likely be felt for many years to come.

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