For the Inventor, By the Inventor

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Hillsboro, OR, United States of America

Nexplanar Corporation

Calculating rank

USPTO Granted Patents = 33

% Expired Patents = 6.1

EPO Patents = 5

Trademarks = 1

Forward Citations = 571

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16 inventors (with patents filed for the assignee):

Diane Scott (21 out of 29 patents)

William C Allison (20 out of 26 patents)

Ping Huang (12 out of 17 patents)

4. Sudhanshu Misra (11 out of 42 patents)

5. Alexander William Simpson (9 out of 26 patents)

6. Pradip Kumar Roy (9 out of 128 patents)

7. Richard Frentzel (8 out of 9 patents)

8. Robert Kerprich (8 out of 11 patents)

9. Manish Deopura (6 out of 8 patents)

10. Paul Andre Lefevre (5 out of 14 patents)

11. James P LaCasse (5 out of 7 patents)

12. Rajeev Bajaj (3 out of 113 patents)

13. Leslie M Charns (2 out of 4 patents)

14. Karey Holland (2 out of 3 patents)

15. Hem M Vaidya (2 out of 13 patents)

Core Competencies:

Polishing Pad

Chemical Mechanical Planarization

Eddy Current Detection

Grooved CMP Pads

Customized Polishing

Polishing Surface

Pore Diameter Distribution

Fabrication Methods

Alignment Feature

Homogeneous Polishing

Transparent Foundation

In-Situ Grooves

33 patents: Sort by Forward Citations

1. 9649742 - Polishing pad having polishing surface with continuous protrusions (2017-05-16),

2. 9597777 - Homogeneous polishing pad for eddy current end-point detection (2017-03-21),

3. 9597770 - Method of fabricating a polishing (2017-03-21),

4. 9597769 - Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer (2017-03-21),

5. 9555518 - Polishing pad with multi-modal distribution of pore diameters (2017-01-31),

6. 9375823 - Grooved CMP pads (2016-06-28),

7. 9296085 - Polishing pad with homogeneous body having discrete protrusions thereon (2016-03-29),

8. 9278424 - Customized polishing pads for CMP and methods of fabrication and use thereof (2016-03-08),

9. 9272388 - Polishing systems (2016-03-01),

10. 9249273 - Polishing pad with alignment feature (2016-02-02),

11. 9238294 - Polishing pad having porogens with liquid filler (2016-01-19),

12. 9211628 - Polishing pad with concentric or approximately concentric polygon groove pattern (2015-12-15),

13. 9180570 - Grooved CMP pad (2015-11-10),

14. 9156124 - Soft polishing pad for polishing a semiconductor substrate (2015-10-13),

15. 9067298 - Polishing pad with grooved foundation layer and polishing surface layer (2015-06-30),

Company Overview

Nexplanar Corporation, based in Hillsboro, Oregon, specializes in advanced surface preparation technologies for the semiconductor industry. The company focuses on developing innovative solutions that enhance the efficiency and effectiveness of wafer cleaning processes. By leveraging cutting-edge research and engineering, Nexplanar aims to address the evolving needs of semiconductor manufacturers, ensuring high-quality production and improved yields in a competitive market. Their expertise encompasses various aspects of semiconductor fabrication, contributing to the advancement of microelectronics.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

33 Patents

#9 in Hillsboro, OR

#105 in Oregon

#10,309 in US

#20,162 in the World

Hillsboro, OR, United States of America

Nexplanar Corporation

Forward Citations = 571

16 inventors:

Diane Scott (21 out of 29 patents)

William C Allison (20 out of 26 patents)

Ping Huang (12 out of 17 patents)

4. Sudhanshu Misra (11 out of 42 patents)

5. Alexander William Simpson (9 out of 26 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nexplanar Corporation. Retrieved from https://idiyas.com/company/nexplanar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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