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Hillsboro, OR, United States of America

Nexplanar Corporation

USPTO Granted Patents = 33

EPO Patents = 5

Trademarks = 1

Forward Citations = 569

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16 inventors (with patents filed for the assignee):

Diane Scott (21 out of 29 patents)

William C Allison (20 out of 26 patents)

Ping Huang (12 out of 17 patents)

4. Sudhanshu Misra (11 out of 42 patents)

5. Alexander William Simpson (9 out of 26 patents)

6. Pradip Kumar Roy (9 out of 128 patents)

7. Richard Frentzel (8 out of 9 patents)

8. Robert Kerprich (8 out of 11 patents)

9. Manish Deopura (6 out of 8 patents)

10. Paul Andre Lefevre (5 out of 14 patents)

11. James P LaCasse (5 out of 7 patents)

12. Rajeev Bajaj (3 out of 111 patents)

13. Leslie M Charns (2 out of 4 patents)

14. Karey Holland (2 out of 3 patents)

15. Hem M Vaidya (2 out of 13 patents)

33 patents: Sort by Forward Citations

1. 9649742 - Polishing pad having polishing surface with continuous protrusions (2017-05-16),

2. 9597777 - Homogeneous polishing pad for eddy current end-point detection (2017-03-21),

3. 9597770 - Method of fabricating a polishing (2017-03-21),

4. 9597769 - Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer (2017-03-21),

5. 9555518 - Polishing pad with multi-modal distribution of pore diameters (2017-01-31),

6. 9375823 - Grooved CMP pads (2016-06-28),

7. 9296085 - Polishing pad with homogeneous body having discrete protrusions thereon (2016-03-29),

8. 9278424 - Customized polishing pads for CMP and methods of fabrication and use thereof (2016-03-08),

9. 9272388 - Polishing systems (2016-03-01),

10. 9249273 - Polishing pad with alignment feature (2016-02-02),

11. 9238294 - Polishing pad having porogens with liquid filler (2016-01-19),

12. 9211628 - Polishing pad with concentric or approximately concentric polygon groove pattern (2015-12-15),

13. 9180570 - Grooved CMP pad (2015-11-10),

14. 9156124 - Soft polishing pad for polishing a semiconductor substrate (2015-10-13),

15. 9067298 - Polishing pad with grooved foundation layer and polishing surface layer (2015-06-30),

NexPlanar Corporation is a technology company specializing in advanced polishing solutions for the semiconductor and advanced materials industries. With their innovative technology, they provide high-performance polishing pads that enable manufacturers to achieve superior results in wafer planarization processes. Their products are designed to improve production yields, reduce costs, and help semiconductor manufacturers to meet the ever-increasing demands of the industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

33 Patents

#10 in Hillsboro, OR

#104 in Oregon

#9,940 in US

#19,530 in the World

Hillsboro, OR, United States of America

Nexplanar Corporation

Forward Citations = 569

16 inventors:

Diane Scott (21 out of 29 patents)

William C Allison (20 out of 26 patents)

Ping Huang (12 out of 17 patents)

4. Sudhanshu Misra (11 out of 42 patents)

5. Alexander William Simpson (9 out of 26 patents)

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